Flexible
manufacturing system to accommodate varying batch
sizes.
Small batches for developmental
projects & speciality applications like aerospace.
Medium
batches for industrial applications.
Large
batches for applications such as consumer electronics.
Expertise in packaging highly
complex VSLI circuits onto miniaturized Printed
Circuit Boards using COB technology.
Equipment like Automatic
Die bonder, High speed automatic Wire bonders
& Automatic Encapsulation Robots are deployed
for the COB assembly.
Full fledged SMT line including
automatic screen printing, pick and plan machine,
Reflow machine, solderin paste, thickness measurement
and paste mixer.
