TTPL uses fully automatic wire bonders designed for providing a total fine pitch, high speed and flexible wedge bonding package. This flexible bonder also offers amazing bonding capability in wide range of products including multi-die, high density matrix, chip-on- flex, chip-on-glass, ceramic devices and LED displays.

 

We can provide mix technology products which can accommodate a bare die, fine pitch wire bonding, conventional surface mount components and several encapsulation options. Placing wire-bond die and SMT components in the same product provides system-level integration that yields flexibility, cost savings, and the opportunity to bring products out to market faster than conventional system on a chip (SOC) methodologies.