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Chip on Board Assemblies
 

TTPL uses fully automatic wire bonders designed for providing a total fine pitch, high speed and flexible wedge bonding package. This flexible bonder also offers amazing bonding capability in wide range of products including multi-die, high density matrix, chip-on- flex, chip-on-glass, ceramic devices and LED displays.

 

We can provide mix technology products which can accommodate a bare die, fine pitch wire bonding, conventional surface mount components and several encapsulation options. Placing wire-bond die and SMT components in the same product provides system-level integration that yields flexibility, cost savings, and the opportunity to bring products out to market faster than conventional system on a chip (SOC) methodologies.

 
Features of our chip on board processes:
Wire bonding accuracy of ± 0.003 mm.
Capacity of 3, 80,000 wires per day.
Die bonding accuracy up to ± 50 microns.
Both manual as well as semiautomatic die bonding facility.
Can handling Chip on tray, Chip on wafer, conductive or non conductive epoxy.
Encapsulation accuracy up to ± 20 microns.
Use of black or transparent epoxy.
Housed in Class ten thousand clean room ESD safe environment.
 
 
 
Automatic Wirebonding
Automatic Wirebonding
 
Chip On Board
Chip On Board
 
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