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Facilities
 
TTPL has State of the art facilities that include:
Chip on Board Line
Electromechanical Assembly Line
Testing
R&D Lab
 
The facility is RoHS compliant, ESD safe and confirms to world class safety and health requirements.
 
Wirebonding
Ultrasonic Cleaning
 Precision Soldering
Wirebonding  Ultrasonic Cleaning   Precision Soldering
     
PCB Separation
Electronic Board Assembly
 Chip On Board Assembly
PCB Separation Electronic Board
Assembly		 Chip On Board
Assembly
     
 
 
Incircuit Testing
Incircuit Testing
 
Wave Soldering
Wave Soldering
 
Reflow Soldering
Reflow Soldering
 
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