Manufacturing Capabilities

Manufacturing Capabilities

Manufacturing Capabilities

Our key manufacturing capabilities include :

Assembly

  • Through-Hole Insertion
  • Paste & Glue Bottom Side (SMD)
  • Hybrid assemblies
  • Conformal Coating – Spray & selective
  • Dispensing, encapsulation & potting
  • Cable and harness Assembly
  • Box Build, sub assembly and system build

Pick and Place

  • 0201,0402, and 0603
  • QFP, QFN, Leadless
  • BGA and Mini BGA

Screen Printing

  • Step Stencil & glue dispensing with IPAG
  • Lead Free with 2 1/2D inspection¬†

Testing

  • Electromechanical Assembly & Test
  • PCB Assembly and Test
  • Reliability Test and Burn in Test

Soldering

  • No clean wave and selective
  • Hand Soldering with process control

Reflow

  • Long process length with chilled water cooling
  • Nitrogen based SMD Reflow
  • Lead Free with superior flux management

Depaneling

  • Router , V-Cut & Punch

Inspection

  • Automated Optical (AOI)
  • Stereo zoom microscopes
  • Profile Projector
  • X-Ray Inspection with cross section analysis

Rework

  • BGA Rework Station
  • High wattage rework

General

  • High volume flash programming
  • Labelling with traceability
  • Packaging development